Henkel’s Productronica India Exhibit to Highlight New Thermally Conductive Technomelt Material, Thermal Management Innovations, Novel Inks and Structural Adhesives for Display Applications
Next-Generation Printed Electronic Inks
Henkel’s market leadership in electrically conductive ink technologies is well-established and the innovation progress continues with its latest advances: Loctite ECI 8000 series positive temperature coefficient ?(PTC) inks and Loctite ECI 7000 series force sensitive resistor ?(FSR) inks. The line of PTC inks provide performance benefits for applications where fast and uniform heating is required. Uniquely, Henkel’s Loctite ECI 8000 PTC inks include a variety of formulations to allow for specific switch off temperatures without the use of electronic control units. This allows heating to a specific set point, which is then maintained at a constant level. There is no risk of overheating and the materials are exceptionally thin for compatibility with very tight spaces.
FSR inks enable varying and controllable ranges of electrical resistance aligned to the required sensitivity level of the application. The new suite of Loctite ECI 7000 series FSR materials allow product responses based on changing levels of force, as opposed to simply responding to force in general. Different intensities of force alter the material’s conductivity, therefore controlling the device response for applications such as medical diagnostic systems, computer touch pads, and music and entertainment devices, among others. (www.henkel-adhesives.com/conductive-inks-coatings-27433.htm)
Advanced Thermal Management Solutions
Also on show in the Henkel stand during Productronica India 2016 will be high performance Bergquist brand thermal management materials. A complete suite of thermal interface solutions, both in pad and liquid dispensed formats, allows manufacturers to select the medium and thermal conductivity required to comply with specific application requirements.
Visitors to the Henkel booth can learn more about award-winning Gap Pad thermal interface materials, which deliver excellent conformability, low stress and effective thermal control. For processes that require automated, high-volume solutions in addition challenging architecture accommodation, Henkel’s Gap Filler materials provide superior thermal conductivity and ultra-conforming properties. Gap Filler thermal products are well-suited for fragile, low-stress applications including power electronics and discrete devices. (www.henkel-adhesives.com/thermal)
Additional technical detail on thermal management strategies will be shared during a presentation by Henkel Business Development Manager, Holger Schuh, on September 22 at 4:40 p.m. as part of the Session 3 Quality and Reliability conference track.
Structural Adhesives for Display Technologies
Henkel’s full portfolio of structural and hot melt adhesives for various display and peripheral applications will be featured in Henkel booth #3155 throughout the three-day event. Adhesives for cover glass assembly to eliminate mechanical techniques, as well as formulations to facilitate bezel and battery cover bonding are among the many enabling display technologies from Henkel. (www.loctite.com/hhdd)
For more information, visit www.henkel-adhesives.com/electronics. To schedule an appointment with a Henkel team member during Productronica India 2016, send an e-mail to email@example.com.