Cadence to Showcase Tensilica DSPs and Design IP at Mobile World Congress 2016
To book an appointment with Cadence engineers or management at Mobile World Congress 2016, please send an email to email@example.com.
Cadence will host meetings with leading systems and semiconductor companies and demonstrate its Tensilica® DSPs for audio, imaging/vision, and IoT and IP for USB Type-C™ subsystem and MIPI®.
- Dolby Audio™ Premium
- Audio Weaver
- Sensor Fusion
- Convolutional neural network (CNN)
- Face detection
- People detection
- IP subsystem for USB Type-C and Power Delivery
- MIPI DSI + DSC mobile display solution
- MIPI SoundWire IoT demo platform
Mobile World Congress 2016 is February 22 to 25, 2016. The show is open from 9:00am to 7:00pm on Monday through Wednesday, and 9:00am to 4:00pm on Thursday.
Fira Gran Via
Av. Joan Carles I
64 08908 L’Hospitalet de Llobregat,
Hall 6, Stand 6L36
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.