OREANDA-NEWS. TDK Corporation, the world's leading supplier of loadports, will feature Hybrid™ N2 Purge loadports for the next generation FABs at SEMICON West 2013 at the Moscone Convention Center in San Francisco, July 9-11. TDK 300mm and 450mm N2 loadports will be on display at booth 913 located in the South Hall.

TDK N2 purge loadports are an effective solution to reduce wafer cross contamination between processes and oxidation. TDK Hybrid™ N2 Purge uses a combination of bottom and front door purge systems to maximize process and cost benefits to the FAB.

The TDK N2 front purge loadport, which is currently being qualified by leading process tool manufacturers, has the advantage of large gas flow available for fast purge, purge nozzles located inside the EFEM, and capability to maintain low humidity and low particles inside the FOUP. Front purge uses existing FOUPs and no mass flow controller is required for front N2 purge.

N2 bottom purge uses semi compliant N2 purge FOUPs. The FOUP door may be closed during N2 bottom purge. N2 purge is found to be effective to improve Cu interconnect reliability. With the demands of ITRS for smaller nodes TDK Corporation with over 10 years' experience with N2 purge systems is working to meet the market requirements with innovative mini environment solutions.