Engineers are developing a new method of processing nanomaterials
OREANDA-NEWS. Engineers are developing a new method of processing nanomaterials that could lead to faster and cheaper manufacturing of flexible, thin film devices, such as touch screens and window coatings.
The “intense pulsed light sintering” method uses high-energy light over an area nearly 7,000 times larger than a laser to fuse nanomaterials in seconds.
The existing method of pulsed light fusion uses temperatures of around 250 degrees Celsius (482 degrees Fahrenheit) to fuse silver nanospheres into structures that conduct electricity. But the new study, published in RSC Advances and led by Rutgers School of Engineering doctoral student Michael Dexter, shows that fusion at 150 degrees Celsius (302 degrees Fahrenheit) works well while retaining the conductivity of the fused silver nanomaterials.
The engineers’ achievement started with silver nanomaterials of different shapes: long, thin rods called nanowires in addition to nanospheres. The sharp reduction in temperature needed for fusion makes it possible to use low-cost, temperature-sensitive plastic substrates like polyethylene terephthalate (PET) and polycarbonate in flexible devices without damaging them.
“Pulsed light sintering of nanomaterials enables really fast manufacturing of flexible devices for economies of scale,” says Rajiv Malhotra, the study’s senior author and assistant professor in the department of mechanical and aerospace engineering at Rutgers University–New Brunswick. “Our innovation extends this capability by allowing cheaper temperature-sensitive substrates to be used.”
Fused silver nanomaterials conduct electricity in devices such as radio-frequency identification (RFID) tags, display devices, and solar cells. Flexible forms of these products rely on fusion of conductive nanomaterials on flexible substrates, or platforms, such as plastics and other polymers.
“The next step is to see whether other nanomaterial shapes, including flat flakes and triangles, will drive fusion temperatures even lower,” Malhotra says.
In another study, published in Scientific Reports, Rutgers and Oregon State University engineers demonstrated pulsed light sintering of copper sulfide nanoparticles, a semiconductor, to make films less than 100 nanometers thick.